vivo x300 series powered by MediaTek Dimensity 9500

MediaTek and vivo have once again joined forces to redefine what’s possible in flagship smartphones. This latest collaboration is the vivo X300, powered by the MediaTek Dimensity 9500, which continues our shared mission to deliver breakthrough performance, energy efficiency, and intelligent experiences to users around the world.

MediaTek and vivo share a long history of partnership, one built on continuous innovation and engineering excellence, which started nearly four years ago with the vivo X80 powered by the Dimensity 9000. Since then, we’ve worked together to redefine the capabilities of flagship smartphones, transforming advanced chip technology into real, meaningful progress for users.

The Dimensity 9500 has allowed vivo to take another major leap forward. From the very beginning of its design, we worked closely with vivo, guided by a shared vision to create a flagship chipset that’s both powerful and efficient, delivering an outstanding experience across every aspect of modern smartphone use.

The MediaTek Dimensity 9500 is our most advanced flagship chipset to date. Built on TSMC’s N3P process, it features our third-generation all-big-core CPU architecture, delivering PC-class performance in a smartphone form factor. With larger caches, an enhanced memory subsystem, and support for UFS 4.1 4-lane storage, the Dimensity 9500 achieves impressive performance gains: up to 32% faster single-core and 17% faster multi-core performance, while also reducing power consumption by up to 37%.

This dual advancement in performance and energy efficiency redefines the standard for flagship chipsets. It enables devices like the vivo X300 to provide smoother multitasking, more immersive gaming, faster AI-driven features, and longer battery life. All without compromise.

The vivo X300, powered by the Dimensity 9500, represents the best of what collaboration can achieve. Together, MediaTek and vivo continue to push the limits of mobile technology, combining our strengths in chip design and device innovation to deliver new experiences that set the pace for the entire industry.