MediaTek | MediaTek Genio 350 | Edge IoT Platforms

Overview

The MediaTek Genio 350 is a highly integrated edge IoT platform featuring a quad-core processor with 4x Arm® Cortex®-A53 cores, built on advanced 14nm process technology. It is designed for embedded systems that require a balance of multimedia support, efficiency, and versatility across industries such as industrial automation, low-power IoT and enterprise devices, access control solutions, and smart home applications.

With OS support for Android, Yocto Linux, and Ubuntu, the Genio 350 provides developers with the flexibility to create scalable, high-performance IoT and intelligent embedded solutions.

Key Features

Capable Quad-core CPU

4x Arm Cortex-A53 @ 2.0 GHz,
for seamless, robust processing.

VPU for Vision Processing

Integrated VPU for visual processing and dedicated audio DSP, ideal for facial and audio recognition with fast response.

High-Resolution Display Support

FHD+ resolution with dual-display capability, ensures immersive visual experiences.

Enhanced Camera Capabilities

Internal ISP supporting: 13MP @ 30fps,
2x MIPI CSI-2 4-Lane,
Dual camera framework.

Multiple Operating Systems

Support Android, Yocto Linux and Ubuntu.

Product Specification

Process

14nm

Processor

Processor (CPU)

4x Arm Cortex-A53, 2.0 GHz

Graphics Processor (GPU)

Arm Mali-G52, 800 MHz

Neural Processing Unit (NPU)

0.35 TOPS

1x Cadence Tensilica Vision 6 DSP (VP6)

Audio DSP

Cadence Tensilica HiFi 4 DSP

Memory and Storage

Memory and Type

x32 LP3-1600 (up to 4 GB)

x32 LP4X-3200 (up to 4 GB)

Storage Type

eMMC 5.1

SD 3.0

SPI-NAND

Multimedia

Display Interface

1x MIPI-DSI (4L, 1.2Gbps/L)

1x DPI / 1x LVDS

Display Controller

Dual Display, Max FHD+HD

Single Display, Max FHD

(Support PQ)

Video-in Interfaces

2x MIPI CSI-2 (4L, 1.5 Gbps/L)

(Virtual Channel: 4x)

Image Signal Processor

1x ISP, 13MP @ 30fps

(3A, NR, AI-FD, LSC, Warp Engine)

Video Decode

MPEG4/H.264/H.265 (FHD60)

Video Encode

H.264 ( FHD60)

Interfaces

USB

1x USB 2.0 (Host)

1x USB 2.0 (Host/Device)

Ethernet

10/100 Ethernet MAC

PCIe

N/A

UART

3x UART

I2C

4x I2C

SPI

1x SPI Master

PWM

3x PWM

I2S/TDM

2x 12S input, 2x I2S output

1x TDM input, 1x TDM output

PDM

4x PDM input

PCM

1x PCM input/output

SPDIF

1x SPDIF input, 1x SPDIF output

Temperature support

Temperature

-20°C to 105°C (Tj)

Package Information

Package Type

VFBGA

Package Dimensions

12.2 x 11.8 x 0.9 mm, 0.4 mm ball pitch

Wireless Connectivity

Integrated Wi-Fi Baseband

Wi-Fi 5 1x1 / BT 5.0 (MT6631)

Security

ARM TrustZone
Security Boot (RSA3072)
Crypto Engine
RNG