Press Room
MediaTek Kompanio Ultra to Redefine On-Device AI and Performance for Chromebook Plus
02 Apr 2025 - 15:00
Flagship Processor Delivers Powerful AI Capabilities and Exceptional Power Efficiency
TSMC and MediaTek Demonstrate First Integrated PMU and PA for Wireless Connectivity Products on N6RF+ Process Technology
12 Mar 2025 - 14:00
HSINCHU, Taiwan, R.O.C. Mar. 12, 2025 - MediaTek and TSMC (TWSE: 2330, NYSE: TSM) announced today that they have jointly demonstrated the first silicon-proven power management unit (PMU) and integrated power amplifier (iPA) on TSMC’s N6RF+ process.
MediaTek Unveils Genio 720 and Genio 520 IoT Platforms for Generative AI Applications
11 Mar 2025 - 20:30
NUREMBERG, Germany – March 11, 2025 – Today at Embedded World, MediaTek introduced the high-performance Genio 720 and Genio 520 edge-AI IoT platforms. These new additions to the Genio series support the latest generative AI models, human machine interface (HMI), multimedia, and connectivity features for smart home, retail, industrial, and commercial IoT devices.
MediaTek Expands Cloud-to-Edge Leadership with Next-Generation Connectivity and AI at MWC 2025
27 Feb 2025 - 07:00
BARCELONA, Spain – February 27, 2025 – At Mobile World Congress 2025, MediaTek is showcasing several key technologies that enable wireless evolution towards 6G, including hybrid computing, a live LEO broadband NR-NTN trial, sub-band full duplex (SBFD), along with the new M90 5G Advanced modem. In addition, the company is also sharing its latest developments in Dimensity Auto and Dimensity...
MediaTek Introduces M90 5G-Advanced Modem with AI and 12Gbps Peak Speed
26 Feb 2025 - 07:00
BARCELONA, Spain - February 26, 2025 – At Mobile World Congress 2025, MediaTek is introducing the M90 5G-Advanced cellular modem solution, which aligns with 3GPP Release 17 and the forthcoming Release 18 specifications. The MediaTek M90 delivers exceptional downlink performance of up to 12Gbps and boosts uplink performance by up to 20% with 3GPP Release 17 2T-2T Uplink TX switching. This new...
MediaTek Dimensity 7400 and Dimensity 6400 Makes Improved Gaming, Connectivity and AI Performance More Accessible
25 Feb 2025 - 07:00
HSINCHU, Taiwan – Feb. 25, 2025 – MediaTek announced a trio of new ultra-efficient chipsets designed to be an integral part of the industry-leading MediaTek Dimensity family, offering exceptional experiences for high-tech and mainstream mobile devices to complement the flagship and premium offerings of the Dimensity 9400 and 8400. The Dimensity 7400 and 7400X are geared to deliver advanced gaming...
Eutelsat, MediaTek and Airbus announce world’s first 5G non-terrestrial network connection, leveraging OneWeb LEO satellites
24 Feb 2025 - 16:00
Eutelsat becomes the first satellite operator to demonstrate the 5G air interface working on a commercial fleet Paving the way for deployment of 5G NTN and interoperability between terrestrial and satellite technologies Placing Eutelsat at the forefront of 5G NTN innovation, a key feature of the future IRIS2 constellation Paris, 24 February 2025 – Eutelsat Group (ISIN: FR0010221234 - Euronext...
MediaTek Collaborates with NVIDIA on the New NVIDIA GB10 Grace Blackwell Superchip Powering the NVIDIA Project DIGITS Personal AI Supercomputer
06 Jan 2025 - 20:30
LAS VEGAS – CES – Jan 6, 2025 – MediaTek today announced it has collaborated with NVIDIA on the design of the NVIDIA GB10 Grace Blackwell Superchip for NVIDIA Project DIGITS, a personal AI supercomputer.
MediaTek and Intelligo to Showcase Multiple AI Voice Solutions at CES 2025
06 Jan 2025 - 09:00
LAS VEGAS, NV – Jan. 6, 2025 – MediaTek, a global leader in IC design, and Intelligo, a pioneer in edge AI technology, announced that they will collaborate to deliver innovative AI voice solutions for the automotive, smart home, and smart retail markets, which will debut at CES 2025. The cooperation will be dedicated to transforming how users interact with vehicles and smart home devices,...
MediaTek Unveils the Dimensity 8400, the First All Big Core Chip for Premium Smartphones
23 Dec 2024 - 03:30
HSINCHU, Taiwan – Dec. 23, 2024– MediaTek today announced the Dimensity 8400, a premium smartphone chip offering the most powerful Gen-AI performance in its class. Building on the legacy of the flagship Dimensity 9400, the MediaTek Dimensity 8400 brings an All Big Core design to the premium smartphone market for the first time. The All Big Core CPU is paired with a powerful NPU to accelerate...
